Part Number : 5962-8764903YA | Alternate P/N : 59628764903YA |
NSN : 5962-01-301-41655962013014165 | Item Name : Microcircuit Memory |
Manufacturer : Dla Land And Maritime | CAGE Code : 67268 |
FSC : FSC5962 Microcircuits Electronic | NIIN : 013014165 |
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-301-4165 Item Description: MICROCIRCUIT,MEMORY | 5962 | 013014165 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
X28256EMB-25 | 3 | 1 | 4 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES UM" |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES UM" |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES UM" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
AGAV | END ITEM IDENTIFICATION | ALQ-135B" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND BIDIRECTIONAL AND ERASABLE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS UM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | ROM" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES UM" |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES UM" |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES UM" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
AGAV | END ITEM IDENTIFICATION | ALQ-135B" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND BIDIRECTIONAL AND ERASABLE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS UM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | ROM" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
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